Diamond Band Saw for Semiconductors, Silicon, Sapphire, Glass, Waffer, Stone, Ceramic

Prod Model:	L1800~L7800
Markets:	North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
Length:	3750
Shank Thick:	0.7
Width:	38
Manufacturing Arts:	Electroplating
Usage:	for Semiconductors Cutting
Thickness:	0.3~0.8
Shape:	Circular
Kind:	Band Saw Cutting Machine
Brand:	Xinya
Saw Blade External Diameter:	L1800~L7800
Specification:	L1800~L7800

Product Description

Length	Width	Shank thickness	Tip thickness	Diamond grit	Tip shape
2700mm	10/20/38/40	0.4/0.5/0.6/mm	0.6/0.7/0.8mm	140/170	half-moon/straight line
3230mm	20/38/40	0.5/0.6/0.7mm	0.8/0.9/1.0mm	100/120	half-moon/straight line
3750mm	30/38/40	0.5/0.6/0.7mm	0.8/0.9/1.0mm	100/120	half-moon/straight line
3920mm	30/38/40	0.5/0.6/0.7mm	0.8/0.9/1.0mm	100/120	half-moon/straight line
4410mm	38/40	0.5/0.6/0.7mm	0.8/0.9/1.0mm	100/120	half-moon/straight line
5700mm	38/40	0.5/0.6/0.7mm	0.8/0.9/1.0mm	100/120	half-moon/straight line

  The electroplated diamond band saw blades are used for cutting Semiconductors material, such as silicon, sapphire.
The special diamond saw blades for Semiconductors material have the highest sharpness and the best cutting effect. They are designed for cutting silicon ingot, sapphire ingot and so on.
  This kind of electroplated Diamond Band Saw have good sharpness and long life time,the single-deck on the surface of cutting part,so the cutting precision and the shape keeping performance all can be guaranteed.
  In the processing of the electroplated diamond band saw,the heating temperature of the diamond is less than 100ºC,so the damage to the diamond is very small,then the Electroplated Diamond Band Saw can also have the good long life time.
  Try it,and you will love it!