Precision CNC Specimen Cutting Machine with Accessories
Price: |
US $ 8700/Piece |
Min Order: |
1/Piece |
Pay Type: |
L/C,T/T,Western Union |
Prod Model: |
CY-SYJ-400 |
Accuracy: |
0.0025mm |
X-Axis: |
1-50mm/Min |
Y-Axis: |
1-50mm/Min |
Z-Axis: |
1-20mm/Min |
Name: |
Specimen Cutting Machine |
Warranty: |
One Year |
Type: |
Surface Grinding Machine |
Processing Object: |
Gear |
Controlling Mode: |
CNC |
Automatic Grade: |
Automatic |
Precision: |
Precision |
Certification: |
TUV |
Product Description
Introduction of specimen cutting machine
SYJ-400 is a CE certified precise dicing and cutting solution for R&D Lab in Materials and Microelectronics research field. It is designed for dicing and cutting almost all kinds of materials up to 4" diameter wafer or 8" L x 4" W x 1" H components. The EC-400 saw can
be computerized with position accuracy of 0.01 mm. The sample stage with two angles adjustment allows customers to cut materials at the desired angle with +/- 0.5° tolerance. Laptop with software and USB cable are installed.
Technical parameter of specimen cutting machine Voltage | AC 110V or AC 220V +/- 10% |
Motor | Brush-less magneto DC motor (110V) with variable speed up to 3,000 rpm. Power consumption: 180W |
Effective Cutting Range | 3 dimension: X-axis: 8" Y-axis:4" Z-axis:4" |
Moving/Cutting Speed Range | X-axis: 1-50mm/min adjustable Y-axis: 1-50mm/min adjustable Z-axis: 1-20mm/min adjustable |
Accuracy | 0.0025 mm moving resolution and 0.01 mm position accuracy. |
Cutting Blades Kits | One 4" Dia x, 0.35 mm thick fully sintered diamond blade Two pairs of flanges with 62 mm Dia. ( for dicing ) and 42 mm Dia. (for deep cutting) |
PC Software | Laptop and PC software are provided with the equipment. Cutting parameters can be set in software as cutting length, width, diameter, time, feed speed, kerf loss, etc Manual or programmable control mode |
Water Cooling | Assemblies of water jetting, draining, and Transparent plastic splashing protection is included. |
Accessories | Complete accessories are included for immediate use, including 120L/min Oilless vacuum pump, 4" diamond blade and sample holder.etc. One vacuum chuck (P/N ECO402) and adhesive film (P/N ECO 419).are included for dicing the thin wafer |
Optionals | For longer wire life, please use LubeCool -150 Smart Solid Lubricant and Coolant For better lighting, please consider a Fiber Optic Y-shape Dual Light Microscope Illuminator In order to ensure accurate alignment when cutting the wafer, you should choose 25x stereo microscope with support frame For dicing Si, Ge, GaAs and quartz, LiNbO3 wafers, you may consider using 100 microns ultra-thin diamond blade because of fewer kerfs. |
Net WT& DIMEN | Net Weight: 33.5 kg 580 L x 560 W x 660 H (mm) |
Shipping WT & DIMEN | Shipping weight: 170 lbs 48"L x 40"W x 37"H (inch) |
Warranty & Compliance | One year limited with lifetime support |
More photos of specimen cutting machine
Zhengzhou CY Scientific Instrument Co., Ltd. Materials Science and Technology Co., Ltd. is a high and new technology enterprise registered in Zhengzhou city of Henan province, mainly engaged in the research and development, design, manufacturing and sales of equipment used in scientific researches. Independence and innovation is the company's tenet. On the basis of sticking to independent innovation, the company absorbs extensively the advanced technology of excellent products at home and abroad. Meanwhile, the company studies, develops and manufactures various kinds of heating equipment and experimental instrument with consideration of our comprehensive national conditions. The company has solid technical force and forms a thorough research and development system by cooperating closely with a number of research institutes.