| Markets: |
North America,Eastern Europe,Eastern Asia,Western Europe |
Product Description
We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor.
The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.
Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.
Taizhou Sumeng Grinding Wheel Co., Ltd. (including Jiangsu Subei Grinding Wheel Factory Co. Ltd, Bondflex Abrasives Co Ltd, SUZHOU SAILI PRECISION TOOLS CO Ltd) is leading factory specialized in manufacturing bonded abrasive products and Superabrasives tool, large O. D. Reinforced Cutting Wheels, Crankshaft Grinding Wheels, Cutting and Grinding Discs, Diamond & CBN Wheels, TCT Saw Blades, Diamond Tools etc.
