| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Usage: |
Semiconductor Cutting |
| Manufacturing Arts: |
Electroplating |
| Saw Blade External Diameter: |
0.12mm~0.50mm |
| Kind: |
Processing of Sapphire |
Product Description
Electroplated diamond wire is a type of fixed abrasive diamond wire. It's used for cutting Semiconductors material, such as silicon, sapphire. Based on the abrasion and cutting principle between the abrasive fixed on the steel wire and the workpiece materials, the abrasive particles do not directly act on the wire saw. Such rigid cutting method greatly improved the cutting efficiency.
Product advantages:
1) Capable of cutting large-sized ingots; Material-saving, high-efficiency and cost-effective
2) Capable of cutting materials with high rigidity and high brittleness such as sapphire
3) Little damage on the processed surface, little deformation
4) Thin slices, with uniform thickness.
Our company had been established in 1998, We have more than ten years production and development diamond product experience, Our factory specialized production each kind of specification diamond grinding wheel, diamond router, diamond wire and diamond band saw.Very good quality, cheap price and we take the good faith as the principle, Welcome to cooperate.
